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In Stock 99.99 % High Purity Copper Cu Sputtering Target

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Copper Cu Sputtering Target Copper Cu Sputtering Target

In Stock 99.99 % High Purity Copper Cu Sputtering Target

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product details

In Stock 99.99 % High Purity Copper Cu Sputtering Target

Introduction


Copper Backing Plate is used for improving the conductivity of the nonmetallic plasma sputtering targets. 

Chemical Symbol Copper
Thickness 2.3 mm OR customized size
Weight 1 oz   or    2  oz
Color Reddish Brown
Application Notes

Used for bonding with nonmetallic sputtering targets.

 




Copper target


Cu Sputtering Target






tags : Cu Sputtering Target Copper Cu Sputtering Target High Purity Copper Cu Sputtering Target
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